Trenz Electronic GmbH TE0835-03-TXE81-AK — RFSoC Module with AMD Zynq™ UltraScale+™ ZU47DR-1E incl. Heat Spreader

TE0835-03-TXE81-AK - RFSoC Module with AMD Zynq™ UltraScale+™ ZU47DR-1E incl. Heat Spreader

TE0835-03-TXE81-E module including pre-assembled heat spreader, size: 6.5 x 9 cm

Technical Specifications

Key Features

The predecessor of this article is TE0835-02-TXE21-AK. All changes are in the Product Change Notification (PCN).

This module is a TE0835-03-TXE81-E with mounted heat spreader.

The Trenz Electronic TE0835 is an extended-grade module based on AMD Zynq™ UltraScale+™ RFSoC. The module is equipped with 4 x 1 GByte DDR4 SDRAM memory, 2 x 64 MByte SPI Flash memory, USB2.0, Ethernet transceiver and 2 x Samtec Razor Beam Board to Board (B2B) connectors. The system controller CPLD is provided by Lattice MachXO2.

The Zynq UltraScale+ RFSoC family integrates key subsystems for multiband, multi-mode cellular radios and cable infrastructure (DOCSIS) into an SoC platform that contains a feature-rich 64-bitquad-core Arm Cortex-A53 and dual-core Arm Cortex-R5 based processing system.

All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

• SoC / FPGA
  • Device: AMD Zynq™ UltraScale+™ RFSoC XCZU47DR-1FFVE1156E Gen3
  • Other assembly options of this series are available with devices
    • ZU25, ZU27, ZU28 (Gen1)
    • ZU43, ZU48 (Gen3)
  • Speedgrade: -1
  • Temperature range: Extended
  • Package: FFVE1156
  • Engine: Quad-core Arm Cortex-A53 MPCore up to 1.3GHz
  • 8 x 14-bit RF-ADCs with 5 GSPS
  • 8 x 14-bit RF-DACs with 9.85 GSPS

• RAM / Storage
  • 4 x 1 GByte DDR4 SDRAM
  • 2 x 64 MByte SPI Boot Flash (dual parallel)
  • 2 Kbit I2C serial EEPROM with EUI-48 Node Identity

• On Board
  • Lattice MachXO2 CPLD
  • Programmable ultra-high-performance DSPLL
  • USB2.0 OTG transceiver
  • Gigabit Ethernet transceiver
  • 3 x Oscillators
  • 4 x user LEDs

• Interface
  • 2 x Samtec Razor Beam ST5 (2 x 80 pol) Board to Board connectors
  • Total I/O: 40 IOs, 20 LVDS, 32 MIO
  • 8 x GTY
  • 4 x GTR

• Power
  • 5V +/- 10 % Input Supply Voltage

• Dimension
  • 6,5 x 9 cm
    

Other assembly options for cost or performance optimization plus high volume prices available on request.

Recommended Software

Vivado Enterprise Edition (paid version)

The Vivado Enterprise Edition is the full-featured version of the design suite and supports all AMD devices.

Overview Vivado Standard and Enterprise Edition

Development Support

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

• 1 x TE0835-03-TXE81-A Trenz Electronic RFSoC module with AMD Zynq™ UltraScale+™ RFSoC ZU47DR
• 1 x mounted heat spreader TE0835-03

Additional Information

• Manufacturer's article number: TE0835-03-TXE81-AK
• Trenz Electronic TE0835 Wiki
• AMD Zynq™ UltraScale+™ RFSoC Product Page
• AMD Zynq™ UltraScale+™ RFSoC Product Selection Guide (PDF)
• Support Forum

All modules produced by Trenz Electronic are developed and manufactured in Germany.

The online pictures of this product are not a legally binding offer, but are symbol pictures for illustration and presentation only.

About Trenz Electronic

Trenz Electronic GmbH (Bielefeld, Germany) designs and manufactures FPGA and SoC modules, carrier boards, starter kits and evaluation platforms based on AMD/Xilinx, Intel/Altera, Microchip, Lattice and Cologne Chip devices. Specifications are sourced from the manufacturer's official product documentation and are subject to change without notice.

Ordering information

Part Number:  TE0835-03-TXE81-AK

Note: Pictures are for reference only; the actual product prevails. For pricing and lead time, please send an inquiry.